DOWSIL™ TC-3065 Thermal Gel is a soft, stress relieving and shock damping silicone gel with a thermal conductivity of 6.5W/mk. It has an excellent extrusion rate (60 g/m) and supports auto-dispensing. DOWSIL™ TC-3065 Gel resists slumping during vertical assembly and completely fills uneven spacing. This dispensable material accommodates higher part-to-part tolerances that can challenge fabricated thermal pads with their constrained dimensions. It is supplied as a non-flowable gel and supports a bond line thickness as thin as 150 microns when high pressure is applied.
DOWSIL™ TC-3065 Thermal Gel can be dispensed onto substrates such as aluminum heat sinks and encapsulated chips that have an epoxy surface. After assembly it can achieve complete curing by applying 100°C for 30 minutes (or 80°C for 60 minutes) or from the heat generated by the component. If rework is required, DOWSIL™ TC-3065 Thermal Gel can be removed completely without leaving behind a residue after curing. At room temperature the working time or open time is generally five days, which helps reduce scrap rates during electronic assembly.
New DOWSIL™ TC-3065 Thermal Gel balances adhesion with re-workability to support advanced technologies that require reliable performance. Unlike some thermally conductive elastomeric pads, this new gel will not bleed silicone oil after full curing, which helps to avoid contamination of device surfaces that can degrade performance. DOWSIL™ TC-3065 Thermal Gel is resistant to humidity and other harsh environments and will not crack during long-term aging.
DOWSIL™ TC-3065 Thermal Gel can be used for optical transceivers, ethernet switches and routers, high-speed solid-state disks (SSD) and other network devices.
DOWSIL™ TC-3065 Thermal Gel is available worldwide through Dow and its extensive network of distribution partners.